Research
on Laser Machining of Ceramics
Michael F. Modest
The rest of this wonderful-to-be page is still
in the rudimentary construction stage!! And God knows when I'll get to
improve it!!
Last update: December 5, 1999
Click here for a slideshow
of our experiments and models, and here for a somewhat more detailed
overview
of our theoretical work.
Presently, we are investigating, experimentally as well as theoretically,
the occurrence and minimization of thermal
stresses during laser machining of ceramics. If you have an mpegviewer,
you can view/download several short movies showing the transient development
of thermal stresses during laser drilling and scribing:
-
CW laser drilling of SiC - temperature
and hoop stress development (4.7MB)
-
CW laser drilling of SiC - temperature
and normal stress development (4.7MB)
-
Pulsed laser drilling of SiC, 1st pulse - temperature
and hoop stress development (0.9MB)
-
Pulsed laser drilling of SiC, 1st pulse -
temperature and normal stress development (0.9MB)
-
Pulsed laser drilling of SiC, 4th pulse - temperature
and hoop stress development (1.3MB)
-
Pulsed laser drilling of SiC, 4th pulse -temperature
and normal stress development (1.3MB)
-
CW laser scribing of SiC - temperature
development (3.2MB)
-
CW laser scribing of SiC - maximum
principal stress development (2.6MB)
-
Pulsed laser scribing of SiC , 1 pulse - temperature
development (1.9MB)
-
Pulsed laser scribing of SiC , 1 pulse - maximum
principal stress development (1.9MB)
To understand the meaning of non-dimensional temperatures and non-dimensional
stresses used in the above movie clips, check out this
Postscript
file.
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